Catch Electronics Shock and Drop Failures Before Hardware Is Built

<img src="https://spectrum.ieee.org/media-library/keysight-logo-for-webinars-and-whitepapers.png?id=27151246&width=980"/><br/><br/><p>Learn how guided virtual shock and drop analysis helps engineering teams identify reliability risks before physical testing, reduce qualification iterations, optimize packaging designs, and accelerate electronics product development.</p><p><strong>What you will learn about: </strong></p><ul><li>Why shock failures found during physical qualification are costly, and how coupled electrical, mechanical, thermal, and packaging effects make them hard to predict.</li><li>How physical drop testing and traditional simulation each leave gaps in timing, expertise, setup effort, and diagnostic detail.</li><li>How guided, template-based virtual workflows model tilt drops, ball impacts, and packaged drops using IEC 60068-2-27 and IEC 60068-2-31 profiles.</li><li>How running the full drop orientation matrix as one validation plan supports packaging optimization, and how correlation with physical tests builds confidence before hardware is committed.</li></ul><div><span><a href="https://content.knowledgehub.wiley.com/shifting-reliability-left-guided-virtual-validation-for-electronics-shock-and-drop-testing/" target="_blank">Download this free whitepaper now!</a></span></div> Reference: https://ift.tt/XJAPNrB