An in-depth examination of how rising power density, 3D integration, and novel materials are outpacing legacy thermal measurement — and what advanced metrology must deliver.
What Attendees will Learn
- Why heat is now the dominant constraint on semiconductor scaling — Explore how heterogeneous integration, 3D stacking, and AI-driven power density have shifted the primary bottleneck from lithography to thermal management, with heat flux projections exceeding 1,000 W/cm² for next-generation accelerators.
- How extreme material properties are redefining thermal design requirements —Understand the measurement challenges posed by nanoscale thin films where bulk assumptions fail, engineered ultra-high-conductivity materials (diamond, BAs, BNNTs), and devices operating above 200 °C in wide-band gap systems.
- Why interfaces and buried layers now govern reliability — Examine how thermal boundary resistance at bonded interfaces, TIM layers, and dielectric stacks has become a first-order reliability accelerator.
- What a thermal-first design workflow looks like in practice — Learn how measured, scale-appropriate thermal properties can be integrated early in the design cycle to calibrate models, reduce uncertainty, and prevent costly late-stage failures across advanced packaging and 3D architectures.
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